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Linkage sputtering
Introduction

• Direction of deposition: up or down

• Muzzle shape: rectangular or cylindrical

• Substrate temperature: Max 300℃ (continuous service standard)

• System control: PLC + touch (manual)

• Optional: Pretreatment unit, substrate slant, Max 800 ℃(PLC + PC)

Reference for sputtering technology



The Word Best Plasma
Contact: Mr. Yu, Mr. Tang
Tel:13612999216 13632910173
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