Products
- Vacuum Plasma Cleaning Machine
- Experimental plasma processor
- Miniature plasma processor
- Medium plasma processor
- PCB USES a horizontal plasma processor
- PCB USES a vertical plasma processor
- Roll to roll plasma processor
- Atmospheric Plasma Cleaning Machine
- Jet type atmospheric plasma processor
- AP type atmospheric plasma processor
- Custom pipelined equipment
- Vacuum Drying System
- Korea imports plasma equipment
- Korea PSM Plasma Cleaning Machine
- Korea LAT plasma equipment
- Vacuum plasma machine consumables
Contact Us
Telephone：86-0755-81452366
Fax：86-0755-81493996
Email：oksun001@szoksun.com
Address：A Xinlong Shenzhen Science Park Baoan District manhole Street King Hill Industrial 6 layer
Korea LAT plasma equipment
Standard sputtering
Direction of deposition: up or down
Muzzle size: 2~4 inches (substrate: ~6 inches)
Substrate temperature: Max 500℃ (standard value for continuous use)
System control: PLC + touch (manual)
Optional: Pretreatment unit, substrate slant, Max 800 ℃
Automatic CNC, data recording (PLC + PC)
6~8 "muzzle (substrate: 6~12") possible, single chamber size variable
Reference for sputtering technology
The Word Best Plasma
Contact: Mr. Yu, Mr. Tang
Tel:13612999216 13632910173