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Semiconductor packaging field
陶瓷封装
Date：2015-12-30 09:12:26 From：OKSUN
陶瓷封装中通常使用金属浆料印制线路板作键合区、盖板密封区。在这些材料的表面电镀Ni、Au前采用等离子体清洗，可去除有机物钻污，明显提高镀层质量。
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